Today IC substrate for advanced chip packaging where the small scale and many pads per unit have been designed requires the advanced final finish process that offers the excellent solderability to ensure smooth assembly and long device’s lifespan. Our high-performance electroless nickel electroless palladium immersion gold (ENEPIG) process provides uniform nickel, palladium and gold surface with excellent reliability for soldering and wire bonding applications. The proprietary palladium and gold process offers high bath stability and delivers optimal metals deposits with corrosion-free characteristics that helps many manufacturers to reduce the cost of ownership.
