Electroless Nickel Immersion Gold

We offer a proprietary technology for electroless nickel immersion gold, applicable to fine-pitch surface mount technology (SMT) components of rigid and flexible printed circuit boards. Each process steps have been researched and developed to ensure that it can work together to create uniform lead-free nickel-phosphorus layer and optimal gold distribution on every pad, as well as reduce nickel corrosion and minimize surface variation. As a result, the entire process provides cost saving through the long lifetimes and excellent layer performance. This makes our process a good choice for next-generation smart phone, electronic components in smart vehicles and today’s electronic devices.