We serve a-state-of-art technology for electrolytic nickel-gold plating processes tailored to a wide variety of finishing applications. Our electrolytic nickel provides an exceptional underlayer that prevents pores or pinhole corrosion caused from gold-copper potential diffusion. Our hard gold provides uniform bright and wear-resistant gold alloys deposits. The processes are typically used for gold finger and keypads, as well as the areas where force of friction is required. Our soft gold delivers smooth pure gold surface finish. The processes allow for exceptional conductive connection and solderability characteristics. This makes us an ideal choice for ball grid array (BGA) devices, chip scale package (CSP), aluminum or gold wiring on chip boards, and applications that require wire bonding, high solderability and weldability.
