The technology challenges of today’s metallization such as, micro-size circuit boards, rapid signal speeds, and advanced resin materials are combined with increasing reliability requirements and reasonable operating cost. To meet these requirements, each processes require the highest quality of operation and chemicals, as well as knowledge and expertise. The origin of success starts with metallization.
Plating Through Hole (PTH) process is a primary metallization process. It is the one of the most critical steps in printed circuit board fabrication. This process allows connections between different layers of a multilayer circuit boards and enable components to be mounted securely to the board.
Auromex’s product ranges of direct metallization and electroless copper allow manufacturers to initiate plating on board materials with excellent uniformity and the highest quality.
