Auromex

Desmear Process

Our Process

Desmear Process

Desmear process involves removing debris from the drill holes, including any epoxy resin that has melted and been dragged over the exposed layers, creating the smear. Auromex’s desmear packages provide the optimal surface to maximize successful application of either direct metallization or electroless copper.

Auromex desmear process is designed to create the optimal surface for application of electroless copper technology packages provide:

  • Excellent wall adhesion for through holes and microvias
  • The maximum performance of subsequent activation
  • Process selection for a wide range of board materials and designs
  • An ideal choice for high aspect ratio boards, HDI and multi-layer PCB applications

Product Portfolio

ThruKlean SW

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ThruKlean SWD

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ThruKlean ET-MN

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ThruKlean NEC

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Auromex desmear process is designed to create the optimal surface for application of electroless copper technology packages provide:

  • Excellent wall adhesion for through holes and microvias
  • The maximum performance of subsequent activation
  • Process selection for a wide range of board materials and designs
  • An ideal choice for high aspect ratio boards, HDI and multi-layer PCB applications

Product Portfolio

ThruKlean H SW

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ThruKlean H SWD

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ThruKlean H ET-MN

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ThruKlean H NEC

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