Circutex system is state-of-the-art electroless copper technology. The technology provides the uniform conductive dielectric layer that allows manufacturers to initiate plating on board materials with excellent circuit uniformity. Our broad portfolio of metallization processes covers all customer requirements and is available for all types of circuit boards.
provides the uniform conductive dielectric layer that allows manufacturers to initiate plating on board materials with excellent circuit uniformity. Our broad portfolio of metallization processes covers all customer requirements and is available for all types of circuit boards
Auromex electroless copper processes are ideally suited for performance critical of multilayer boards. Our processes can be tailored to operate in horizontal or vertical system. We serve a variety of options for many materials including FR-4 epoxies, polyimide, flex materials or low loss materials. For complicated or difficult-to-plate applications such as, HDI or advanced HDI, we offer solution package especially for SAP and mSAP production.